However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied primarily on manual component insertion and wave soldering has transformed ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

Getting BGA soldering right is a big deal, especially when you’re dealing with sensitive electronics for things like planes or power grids. It’s not just about melting solder; it’s a whole process ...

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...

Abstract: In 2015, the International Electronics Manufacturing Initiative (iNEMI) initiated the Bismuth-Tin (Bi-Sn) based Low-Temperature Soldering Process and Reliability (LTSPR) Project. The goal of ...

Abstract: In BGA package assembly, the solder ball attach process is one of the yield off points that impacts the overall product yield and cycle time because of the need to rework. From the beginning ...

Board eliminates the need for custom or BGA-socket-equipped prototyping boards Part of the SchmartBoard|ez pc-board line, a hand-solderable BGA prototyping board is billed as the industry's first.

Fig. 1. Because a socket adapter has a lower mass than a BGA, soldering the BGA to a socket adapter subjects it to less thermal stress than soldering it directly to the pc board. If, for example, the ...