CHANDLER, Arizona — Amkor has started using proprietary processes to create both lidded and fully molded cards in the MultiMedia and SecureDigital card (MMC/SDC) formats using a lead-frame packaging ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

A new large DIP-IPM features a compact transfer-molded package with significantly improved thermal performance compared to previous generations. In addition, it includes a temperature feedback signal ...

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at ...